Join experts from Astera Labs; Cisco Systems; Huawei Technologies, Inc.; Marvell; Meta Platforms, Inc.; NVIDIA; Ranovus; TE Connectivity; and the University of California, Santa Barbara as they provide an overview of the current state of co-packaging standardizations efforts and discuss the potential applications and challenges ahead.
December 6, 2022 – 8:00am-10:00am PST
Todd Rope, Associate Vice President, Firmware, Optics will present on the topic, “OIF Common Management Interface Specification (CMIS).”
More info and links to registration can be found here.
OIF Webinar, “Co-Packaging: Charting the Path Ahead”
December 6, 2022 at 8:00 am-10:00 am PST
Virtual
Register here
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