SANTA CLARA, Calif., September 25, 2025 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark.
The rapid evolution of generative AI technologies and large-scale models is redefining data center architectures, driving unprecedented demand for interconnect performance, bandwidth and power efficiency. This transformation is accelerating the need for high-performance silicon, advanced memory architectures and tightly integrated optical connectivity. As hyperscalers scale massive AI compute clusters across racks, campuses and multi-site topologies, interconnect technologies must be developed to deliver efficiency, scalability and workload-optimized performance.
Marvell is addressing this challenge with a full-stack approach—combining advanced silicon platforms, chiplet-based architectures and breakthrough optical technologies. Together, these innovations unlock new levels of performance across scale-up and scale-out fabrics, reduce latency, lower power consumption, and enable faster deployment at cloud scale.
At ECOC 2025 (stand #C4134), Marvell will showcase technologies that will drive the next generation of AI interconnects, including:
Marvell experts will also deliver presentations on interconnect technologies designed to scale accelerated infrastructure:
About Marvell
To deliver the data infrastructure technology that connects the world, we’re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world’s leading technology companies for over 30 years, we move, store, process and secure the world’s data with semiconductor solutions designed for our customers’ current needs and future ambitions. Through a process of deep collaboration and transparency, we’re ultimately changing the way tomorrow’s enterprise, cloud, automotive, and carrier architectures transform—for the better.
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For further information, contact:
Kim Markle
pr@marvell.com
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