Optical DSPs

Powering the future of AI infrastructure

Thriving Organization

Redefining High-speed Optical Connectivity for the Modern AI Infrastructure


The explosion of AI, cloud and hyperscale computing is driving networks to new extremes. As bandwidth needs surge beyond 800G and move toward 1.6T, optical DSPs are the foundation enabling high-throughput, low-latency, low-power and resilient optical links.

Marvell® is at the forefront of this change, delivering PAM4, coherent and coherent-lite DSPs that power AI fabrics, data center interconnects and telecom networks with unmatched performance and energy efficiency.

Marvell is transforming optical connectivity, enabling higher bandwidth data transmission across every distance regime in modern AI infrastructure.
Connectivity for the Modern AI Infrastructure

Why Are Optical DSPs Essential for AI Infrastructure?


AI workloads generate massive data flows between AI servers, network switches storage systems. Beyond distances of about 10 meters, copper interconnects can’t meet the bandwidth and reach required inside and between AI data centers. 

Optical DSPs are at the heart of the pluggable optical modules that enable data transmission over fiberoptic cables. They convert electrical signals to light, correct distortion in real time, and ensure reliable, low-latency transmission from tens of meters to thousands of kilometers.

As AI data center bandwidth requirements scale from 400 Gbps to 800 Gbps to 1.6 Tbps and beyond, technologies like PAM4, coherent and coherent-lite, as well as silicon photonics, power optical modules that deliver high-bandwidth connectivity inside data centers, across data center campuses and between geographically dispersed data centers.

What is an optical DSP? Arrow

An optical digital signal processor (DSP) converts high-speed electrical data into optical signals and corrects errors to ensure signal integrity over distance. Optical DSPs are used in the pluggable optical modules essential for enabling high-bandwidth, low-latency and power-efficient optical links in AI, cloud and data center networks.

How do optical DSPs differ from copper links? Arrow

Optical DSPs, and the optical modules in which they’re used, transmit data over fiber in the form of light, whereas copper interconnects transmit data over copper in the form of electrical signals. As the data rate increases, the distance over which a signal can travel over copper decreases, making copper interconnects only suitable for short-reach connections. Optical modules based on optical DSPs, meanwhile, are used for distances of tens of meters to thousands of kilometers.

What Are the Types of Optical DSPs?


  • PAM4 DSPs: Inside the Data Center

    These devices are optimized for interconnect distances up to about 500m within cloud and AI data centers. They enable 400G, 800G and now 1.6T pluggable optical modules, offering a balance between cost, energy efficiency and performance. PAM4 DSPs are the powerhouses of intra-data-center interconnects; they connect switches, servers and accelerators with low latency and minimal power consumption. 
  • Coherent DSPs: Between Data Centers

    For longer distances (tens to 1,000+ kilometers), coherent DSPs use complex modulation formats and digital error correction to maintain data integrity over long distances. They’re essential for data center interconnect (DCI) and telecom fiber backbones.
  • Coherent-lite DSPs

    A newer DSP category—coherent-lite—is optimized for campus-scale interconnects operating over distances of 2 to 20km. The O-band-optimized Marvell® Aquila DSP, for example, supports modules that offer 1.6 Tbps bandwidth tailored to connect data center campus buildings more efficiently and cost-effectively than modules based on coherent technology.  
  • Next-gen DSP trends

    AI-optimized DSP architectures, silicon photonics integration and process node advances will all contribute to reducing the amount of power consumed by each bit of data (power per bit) as interconnect bandwidth requirements rise. 

Marvell Leadership and Legacy in Optical DSP Innovation

Marvell optical leadership is grounded in a long history of system design, silicon photonics and digital signal processing expertise highlighted by the addition of Inphi Corporation (acquired April 2021). The Inphi acquisition brought world-class optical DSP IP and engineering talent into Marvell; the combined capabilities enabled Marvell to accelerate the development of both PAM4 and coherent DSP technologies for hyperscale and carrier markets.

Recent product announcements illustrate the leading-edge nature of Marvell optical DSP portfolio: the 3nm Marvell® Ara 1.6 Tbps PAM4 platform, the Marvell® Aquila 1.6 Tbps O-band optimized coherent-lite platform, the award-winning Marvell® COLORZ® 800 DCI module and a broad range of DSP products and chipset components for pluggable and linear optics. These publicly announced product milestones underscore the Marvell strategy of being “first to fastest” with integrated, energy-efficient optical interconnect solutions delivered at scale. 

Marvell Optical DSP Product Table

Product Type Products Key Specifications Primary Use Case
PAM DSPs Ara, Nova, Spica, Perseus, Porrima, Alcor, Polaris, Atlas 50G–1.6T PAM4 DSP portfolio; 3nm–16nm; integrated TIA/driver; low power; FEC and diagnostics AI data centers, cloud interconnects, 800G–1.6T optical modules, short-reach and long-reach pluggables
Coherent DSPs Orion, Canopus, Deneb 400G–800G coherent DSPs; 5nm / 7nm; probabilistic shaping; advanced FEC; multi-rate; low power DCI, metro, long-haul optical transport, IP-over-DWDM, 5G backhaul
Coherent-lite DSPs Aquila O-band optimized; 400G 16-QAM; low-power; 2–20 km reach; integrated drivers Intra-campus optical links; 800G/1.6T campus modules bridging PAM4 and coherent
Optical / DCI Modules COLORZ 800, COLORZ 400 COLORZ Pluggable coherent modules embedding Orion DSP; 400G–800G; long-reach support
Metro / regional / data center interconnect (DCI)
Linear Drivers IN4326DZ, IN6426DZ, IN10026DZ, IN12826FC, IN2814DV etc. High-linearity analog drivers; 100G–1.6T; wide bandwidth; low power Drives optical modulators (EML, MZM) inside PAM4 and coherent modules
TIAs 200G TIA family, Flip-chip TIAs High sensitivity and low noise; 200G/lane; hybrid integration ready

Optical receivers / pluggable modules; analog front end

 

PCIe Retimers Alaska P Gen 6 Retimer Family PCIe Gen6 / CXL PAM4 retimers; extends signal reach; maintains integrity

Extending PCIe over cable / optical links in servers and AI compute fabrics

 

Awards and Industry Recognition


The cutting-edge work Marvell has done in optical DSPs, next-generation interconnects and pluggable optics continues to gain industry validation. Below are some of the key honors that underscore how Marvell is a leader in connectivity innovation:

These accolades reaffirm the strength and ability of Marvell to enable high-speed, energy-efficient optical connectivity and contribute to its growing authority and influence in AI infrastructure. 

Marvell 1.6 Tbps Optical DSP Solutions

Application DESCRIPTION Products
Campus

Connects buildings in large data center campuses over distances of 2–20km

Marvell Aquila coherent-lite DSP platform
Industry’s only O-band-optimized coherent-lite DSP

Frontend network

Connects AI servers to the rest of the data center over distances of up to 500m

Marvell Ara 3nm 1.6T PAM4 DSP platform
Industry's first 3nm low-power solution for optical module

Backend network

Connects AI servers within a cluster

Marvell Ara 3nm 1.6T PAM4 DSP platform
Industry's first 3nm low-power solution for optical module

Scale-up network

Connects AI servers within an AI cluster

Low-power TIA and laser driver chipset for linear-drive pluggable optics (LPO)
Low latency solution for compute fabrics

The Evolution of AI Interconnects

Marvell Vision for the Future of Optical Connectivity

The Marvell optical vision is focused on:

  • Advancing bandwidth to 1.6T and beyond
  • Pioneering 2nm-class DSPs for power-per-bit efficiency
  • Enabling open, interoperable ecosystems through collaboration with hyperscalers and optical module partners
  • Driving co-packaged optics (CPO) readiness for AI systems
  • Supporting sustainable data centers by reducing power consumption across all optical layers

Marvell continues to push the boundaries of optical performance, ensuring that every bit in the AI era moves faster and greener.

Optical DSP FAQs

How do DSP chips work inside optical transceivers? Arrow

DSP chips convert electrical data into optical signals, correct distortions, and optimize transmission quality—enabling faster, low-error data transfer across fiber networks. 

What’s the difference between PAM4 and coherent DSPs? Arrow

The PAM4 modulation used in PAM4 DSPs is optimized for optical interconnects inside the data center for distances of up to about 500 meters. Coherent technology, which uses more complex QAM modulation, is used for between-data-center connections that can exceed 1,000km. Data center interconnect (DCI) is the term used to describe these types of long-distance connections between data centers.

What is coherent-lite technology? Arrow

Coherent-lite DSP technology borrows attributes from both coherent and PAM4 DSP technologies. Modules based on coherent-lite DSPs have the operational attributes of PAM4 DSPs but with greater reach, making them power- and performance-optimized for 2–20km campus connections.

How does Marvell ensure efficiency in optical DSPs? Arrow

Marvell uses process-node leadership, architectural optimization, and advanced IP to ensure its optical DSPs are efficient and provide a competitive advantage.

Which companies are leaders in the optical DSP market? Arrow

Analysts consistently recognize Marvell among the global leaders in PAM4 and coherent optical DSP innovation.

How do optical DSPs enable AI workloads? Arrow

Optical DSPs ensure high-bandwidth, low-latency connections between compute racks, rows and data centers, which is critical for AI model training and inference.

What’s next on the Marvell optical DSP roadmap? Arrow

Marvell is currently working on 1.6T+ products, process node advances, silicon photonics, and new technologies.

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