Custom ASIC
Customizing data infrastructure with best-in-class ASIC IP and design capabilities
- PRODUCTS
- COMPANY
- SUPPORT
- PRODUCTS
- BY TYPE
- BY MARKET
Compute
Networking
Storage
Custom
- COMPANY
- SUPPORT
BY TYPE
Custom
BY MARKET
Custom ASIC
The proliferation of the data economy is accelerating and putting significant strains on global data infrastructure. In order to stay ahead of increasing demands by delivering highly efficient innovations, it is becoming critical data infrastructure original equipment manufacturers (OEMs) and cloud data centers optimize their system-level solutions with customized application specific integrated circuits (ASICs). Marvell’s custom ASIC offering, built over the last 25 years, address this need with a best-in-class portfolio of data infrastructure intellectual property (IP) and a wide-array of flexible business models.
Marvell’s custom ASIC offerings specialize in addressing the complex, high-speed, high-performance ASICs required to power the next generation of 5G carrier, cloud data center, enterprise, machine learning, wired and wireless data infrastructure applications. Our broad and growing portfolio of IP spanning compute, embedded memories, high-speed SERDES, networking, security and storage, accelerates time to market and is optimized for performance, power and area, enabling optimal customer returns on investments.
Our global custom ASIC solutions team has delivered hundreds of customized high-speed SERDES-based ASICs and is investing in the following critical technology, IP and capability areas for our customers’ next generation of ASICs:
- Leading-edge silicon processes beyond 5nm
- Comprehensive low-power design and test methodologies
- High-speed, multi-protocol, mixed-signal SERDES IP ranging from 1Gbps to beyond 112Gbps supporting short to long reaches across Ethernet, PCIe, SAS and SATA carrier, compute, machine learning networking, and storage applications.
- Wide-range of leading memory interfaces and controllers: 6400 MTps LPDDR5/4X/4 & DDR5/4 , 16 GTps GDDR6, 6GTps HBM3 and 3.2GTps HBM2E.
- High-density optimized embedded memories
- Standard and proprietary chip to chip interfaces for chiplet solutions.
- Advanced packaging options for multi-chip offerings: organic MCMs, 2.5D silicon interposers and 3D TSVs.
Recent News
Marvell Completes Acquisition of Avera Semi
Nov 05, 2019
Marvell in the News
Additional Information
Additional product information is available under NDA on the Marvell Extranets. To contact Marvell Sales, please submit your inquiry via request for information below.
Copyright © 2020 Marvell, All rights reserved.
- Terms of Use
- Privacy Policy
- Contact