Date: Tuesday, May 31st, 1:30 p.m. – 3:00 p.m.
Chairs: E. Jan Vardaman, TechSearch International, Inc.
Description: The next generation of advanced packaging will see greater adoption of heterogeneous integration in the form of chiplets as we move into the 3nm semiconductor node. The design, assembly, and test of packages will become more complex, new substrates may be required, and with 3D formats, the move to hybrid bonding is anticipated. Energy requirements in datacenters and performance needs are driving the adoption of co-packaged optics. This panel will discuss changes in the infrastructure required to meet these needs, including the role that the foundry and the OSAT will play. New material requirements will be addressed, the importance of co-design will be highlighted, the need for new thermal solutions will be discussed, and changes in the test approach will be investigated.
Ashkan Seyedi, NVIDIA
Jie Xue, CISCO
Kevin O’Buckley, General Manager, ASICs, Marvell
Raja Swaminathan, AMD
Date: Wednesday, June 1st
Speaker: Chris Koopmans, Chief Operations Officer
Abstract: Over the past five years, Marvell Technology has transformed from being a broad, consumer-oriented company to an industry-leading data infrastructure semiconductor solutions provider. Data infrastructure is a large, fast-growing market that powers our global economy and is crucial in advancing our society. This keynote session will discuss why and how Marvell transformed itself to data infrastructure. The presentation will share insights into how data infrastructure is converging into the cloud, the emerging cloud-optimized silicon era and the technology areas the industry must tackle to accelerate the power of data infrastructure with cloud-optimized silicon.