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  • July 08, 2026

    Scaling AI Networks with Intelligent Ethernet: Validating Packet Trimming, Auto Load Balancing (ALB) and Ultra Ethernet Transport (UET) on Marvell Teralynx

    By Vikram Dattatri, Senior Engineer, Cloud Platform Group, Marvell

    Packet trimming doesn’t prevent traffic losses from occurring; instead, it streamlines the process for recovering them. It is also one of many technologies Marvell is developing to optimize networks for the AI era.

    Artificial intelligence infrastructure is driving a fundamental shift in how data center networks are designed, validated, and deployed. As clusters scale to thousands—or even tens of thousands—of GPUs, the network is no longer just a connectivity layer. It becomes a tightly coupled component of the compute system, directly impacting job completion time, efficiency and overall cost.

    To address these evolving requirements, Ethernet is undergoing a transformation. At OFC 2026, Marvell and Keysight Technologies demonstrated (see the video below) how next-generation Ethernet fabrics can meet the demands of AI workloads through a combination of advanced features and realistic validation. Leveraging Keysight’s KAI Data Center Builder and AresONE‑M 800GE platform, the collaboration showcased how the Marvell® Teralynx® switch fabric supports emerging Ultra Ethernet Consortium (UEC) capabilities, with a particular focus on packet trimming, Auto Load Balancing (ALB) and Ultra Ethernet Transport (UET).

  • July 01, 2026

    Innovating Sustainably: Recognized Among the World’s Most Sustainable Companies in 2026

    By Vienna Alexander, Marketing Content Professional, Marvell

    TIME Magazine has recognized Marvell as one of the World's Most Sustainable Companies for the third year in a row. Marvell is honored to have been represented since the origin of this ranking, as the company has demonstrated consistent, measurable progress across a number of sustainability initiatives.

  • June 24, 2026

    Structera X and A CXL Compression: Making Every Gigabyte Count

    By Arifur Rahman, Director of Product Marketing, Custom Cloud Solutions, Marvell

    Modern AI workloads are insatiable consumers of memory. Deep learning recommendation models (DLRM), large language model (LLM) inference, in-memory databases and vector search engines all share a common bottleneck: there is never enough DRAM, and what exists is very expensive.

    At today's spot prices—$27–$37 per GB for server-grade DDR5 RDIMMs1—a 12TB memory pool requires nearly half a million dollars in DRAM alone. Meanwhile, AI infrastructure buildouts are consuming server DRAM capacity faster than fabs can produce it, driving prices up 300–400% since mid-2025.1, 2

    CXL memory expansion was supposed to solve this. And it does—but there's a subtler lever that most solutions ignore: the data sitting in that memory is compressible, and most CXL controllers don't touch it.

  • June 17, 2026

    Plasmonics: A Path to Higher Bandwidth in Optics in the AI Era

    By Claudia Hoessbacher, Senior Director, and Wolfgang Heni, Director, Optical Engineering, Marvell

    Plasmons have been used to accelerate drug discovery, enhance the sensitivity of sensors and even create artistic treasures in the Roman era.

    Ongoing research at Marvell seeks to harness them to improve the performance of optical networks for the AI era. Plasmonics, a technology that leverages the properties of surface plasmon polaritons (SPPs), provides a promising pathway for enhancing the roadmap of silicon photonic (SiPho) light engines, a critical component inside optical modules.

    Plasmonic-based SiPho light engines could support modules operating at 3.2T and beyond while consuming a fraction of the space and power per bit of modules based on existing technologies. Manufacturers could leverage foundry process technologies for scaling production.

  • May 28, 2026

    Open CPX Sets the Stage for More Flexible, Scalable Connectivity

    By George Hervey, Associate Vice President, Cloud Switch Marketing, Marvell

    Co-packaged connectivity is coming. The Open CPX MSA (Co-packaging Multisource Agreement) is working to simplify adoption.

    The consortium, which includes Marvell and other leaders in connectivity, is developing specifications and standards for solutions for integrating near-packaged optical (NPO) and/or co-packaged optical (CPO) technology into switches and servers in scalable, repeatable ways. Members are also working to support interoperability with co-packaged copper (CPC).

    The idea is to give data center service providers, equipment manufacturers and others a unified framework for next-generation connectivity to accelerate innovation and meet the surging demand for these technologies. Fewer than one million near- and co-packaged ports shipped in 2025, according to LightCounting; by 2030, shipments are projected to surpass 100 million ports per year.1 Standards that can ensure predictability and flexibility will be critical in enabling this expected growth.

    “The initial target of the MSA will be to develop an optimized optical engine with a defined pluggable socket and electrical connector system supporting high speed and high-density connectivity between a switch or processor and co-packaged and near-package interconnects,” the Open CPX MSA website states. “The specifications will define connector mechanicals, thermals, electrical pinout, mechanical form factors, electrical, optical, and management interface specifications to ensure interoperability between multiple vendors of Open CPX.”

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