Latest Marvell Blog Articles
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April 16, 2026
HCDS Best Paper Award Winner: Bridging the Memory Hierarchy Gap with Photonic Fabric™ Technology
By Vienna Alexander, Marketing Content Professional, Marvell
At the Heterogeneous Composable and Disaggregated Systems (HCDS) Workshop, co-located with Architectural Support for Programming Languages and Operating Systems (ASPLOS), Senior Staff Engineer Jing Ding won Best Paper for her research on the Marvell® Photonic Fabric™ Technology Platform.
There is a critical mismatch between the capacity and bandwidth available across memory tiers and the demands of large-scale LLM inference, revealed through characterizing KV cache retrieval efficiency. In fact, across LLaMA3-8B to 405B on NVIDIA A100/H200 systems, retrieving KV cache from host memory achieves up to 100x speedup over GPU re-computation for contexts up to 4M tokens, but host DRAM capacity cannot accommodate the KV demands of long-context, multi-tenant and multi-turn workloads.
While CXL-enabled memory pooling could be applied in this capacity, it faces fundamental electrical interconnect limitations, namely rack-scale distance constraints, switch contention under multi-host workloads, and power-thermal scaling challenges. By leveraging the Photonic Fabric™ optical interconnect technology platform to break reach limitations, along with CXL as a host communication protocol, Marvell enables a unique pod-scale memory sharing appliance that can enable up to 16 servers across multiple racks to dynamically share up to 32 TB of memory capacity.
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April 15, 2026
OFC 2026: Next Generation Die-to-Die Interconnects for XPUs
By John Ma, Senior Director of Design Engineering, AMS COMPHY, Marvell
Although they are the shortest class of interconnect technologies in terms of length, die-to-die (D2D) interconnects and other so-called scale-inside technologies for moving data between compute and memory die inside XPUs and chip packaging have an outsized impact on performance, efficiency and total cost of ownership.
The growing scale and complexity of AI workloads, meanwhile, and the expected development of 3D and other multilayer chip designs mean that more data will be moving across more and longer scale-inside links and at faster speeds than ever before. Advances in packaging, high-speed I/O interfaces, and other technologies will be needed to meet the demands of tomorrow’s algorithms.
At OFC, Marvell showcased a recent advancement in scale-inside: a 3nm 40 Gbps D2D interface for linking HBM and compute die within the same chip package. The increase in speed enables designers to dramatically improve performance and latency while diving down power and silicon area needed for interfaces. The wide-open bathtub curve shown on the monitors in the video demonstrates exceptional signal integrity and reliability.
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April 09, 2026
Live from OFC: Pioneering a New Class of Interconnects—Hybrid AEC/ACC Cables—for Optimizing Infrastructure
By Nicola Bramante, Senior Principal Engineer, Connectivity Marketing, Marvell
Why develop a hybrid cable? Because the quest for greater optimization in AI data centers never ends.
High speed cable developer and manufacturer Luxshare-Tech and Marvell showed off the industry’s first hybrid AEC/ACC solution at OFC 2026, the latest step in enhancing copper interconnects to meet the stringent power, performance and reach standards of AI infrastructure.
Active electrical cables (AECs) are designed for comparatively long (~4-9 meter) high-bandwidth connections within or between racks. The boost in reach over passive copper cables is accomplished by integrating optimized AEC DSPs into the terminal ends of a cable. Active Copper Cables (ACCs), by contrast, rely on equalizers and redrivers for extending reach. ACCs consume far less power than AECs but generally are deployed for in-rack connections running 2 meters or less.
Hybrid AEC/ACC cables combine technologies from both for a solution that delivers a longer, AEC-like reach and the low latency, low power, low cost and low complexity benefits of ACC designs.
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April 03, 2026
Marvell Receives Additional Award for Trustworthiness
By Vienna Alexander, Marketing Content Professional, Marvell
Marvell was recognized in the Most Trustworthy Companies in America list for 2026. This award builds upon the related honor Marvell received in September last year on a global scale: the World’s Most Trustworthy Companies list.
Marvell has proven to be both a leader in trustworthiness and related qualities such as charitability, transparency, sustainability, and numerous workplace awards accumulated in the past year alone. The company also has a proven track record of technical excellence, winning awards for many innovative products. These honors validate and reinforce the strong partnerships of Marvell with its collaborators, customers, employees, stakeholders, and prospective talent. Trust is a key ingredient for these important relationships.
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April 02, 2026
Marvell Named as a Platinum Employer on Where You Work Matters 2026 List
By Vienna Alexander, Marketing Content Professional, Marvell
The inaugural Where You Work Matters list named Marvell as a Platinum Employer for Stability, recognizing the company’s position as a leader in building a strong culture and supporting long-term career growth.
The Where You Work Matters list, created by the Burning Glass Institute and Schultz Family Foundation in collaboration with Harvard Business School, analyzed the job titles and career moves of more than 12 million Americans working across 553 occupation groups at 1,750 U.S. employers—equating to 55 thousand jobs assessed—between 2019 and 2024. One thousand companies received awards as coveted places for career progression.
Recent Posts
- HCDS Best Paper Award Winner: Bridging the Memory Hierarchy Gap with Photonic Fabric™ Technology
- OFC 2026: Next Generation Die-to-Die Interconnects for XPUs
- Live from OFC: Pioneering a New Class of Interconnects—Hybrid AEC/ACC Cables—for Optimizing Infrastructure
- Marvell Receives Additional Award for Trustworthiness
- Marvell Named as a Platinum Employer on Where You Work Matters 2026 List
