Archive for the 'AI' Category
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December 19, 2024
Custom, Copper and Cross-Country Connectivity: Eight Big Trends for Marvell in 2024
By Michael Kanellos, Head of Influencer Relations, Marvell
What happened in semis and accelerated infrastructure in 2024? Here is the recap:
1. Custom Controls the Future
Until relatively recently, computing performance was achieved by increasing transistor density à la Moore’s Law. In the future, it will be achieved through innovative design, and many of those innovative design ideas will come to market first—and mostly— through custom processors tailored to use cases, software environments and performance goals thanks to a convergence of unusual and unstoppable forces1 that quietly began years ago.
- At Marvell AI Day, we announced that custom processors would represent 25% of the AI accelerator market by 2028 and exceed $42 billion. We also announced we had secured four designs with three of the major hyperscalers.
- In July, we unveiled StructeraTM A and Structera X,2 CXL controllers for near memory compute and increasing memory capacity, respectively. Merchant and custom versions of the chips were released at the same time, a reverse of the traditional pattern where custom chips might follow merchant ones by a lengthy lag.
- At OCP, Meta showed off FBNIC, a custom network interface developed in collaboration with Marvell to reduce the time needed to resolve network issues.3 Make that four out of four hyperscalers. See the image below.
FB NIC on display at OFC- In December, we announced a five-year collaboration that includes supplying custom AI products and other devices for AWS.4 The collaboration also encompasses performing semiconductor design tasks in the cloud, which promises to reduce the time and cost of creating new chips.
- Finally, we ended the year with an alliance for custom high bandwidth memory with Micron, Samsung Electronics, and SK hynix.5 Custom HBM can reduce chip real estate by up to 25% and increase memory capacity by up to 33%.6 Custom HBM runs against industry orthodoxy,7 writes analyst Joseph Byrne, but it could pay dividends.
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December 11, 2024
O-Band Optics: A New Market for Optimizing the Cloud
By Michael Kanellos, Head of Influencer Relations, Marvell
Data infrastructure needs more: more capacity, speed, efficiency, bandwidth and, ultimately, more data centers. The number of data centers owned by the top four cloud operators has grown by 73% since 20201, while total worldwide data center capacity is expected to double to 79 megawatts (MW) in the near future2.
Aquila, the industry’s first O-band coherent DSP, marks a new chapter in optical technology. O-band optics lower the power consumption and complexity of optical modules for links ranging from two to 20 kilometers. O-band modules are longer in reach than PAM4-based optical modules used inside data centers and shorter than C-band and L-band coherent modules. They provide users with an optimized solution for the growing number of data center campuses emerging to manage the expected AI data traffic.
Take a deep dive into our O-band technology with Xi Wang’s blog, O-Band Coherent, An Idea Whose Time is (Nearly) Here, originally published in March, below:
O-Band Coherent: An Idea Whose Time Is (Nearly) Here
By Xi Wang, Vice President of Product Marketing of Optical Connectivity, MarvellOver the last 20 years, data rates for optical technology have climbed 1000x while power per bit has declined by 100x, a stunning trajectory that in many ways paved the way for the cloud, mobile Internet and streaming media.
AI represents the next inflection point in bandwidth demand. Servers powered by AI accelerators and GPUs have far greater bandwidth needs than typical cloud servers: seven high-end GPUs alone can max out a switch that ordinarily can handle 500 cloud two-processor servers. Just as important, demand for AI services, and higher-value AI services such as medical imaging or predictive maintenance, will further drive the need for more bandwidth. The AI market alone is expected to reach $407 billion by 2027.
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November 12, 2024
2006: The Twelve Months That Changed the Chip Industry
By Michael Kanellos, Head of Influencer Relations, Marvell
The semiconductor market is vastly different than it was a few years ago. Cloud service providers want custom silicon and collaborating with partners on designs. Chiplets and 3D devices, long discussed in the future tense, are a growing sector of the market. Moore’s Law? It’s still alive, but manufacturers and designers are following it by different means than simply shrinking transistors.
And by sheer coincidence, many of the forces propelling these changes happened in the same year: 2006.
The Magic of Scaling Slows.
While Moore’s Law has slowed, it is still alive; semiconductor companies continue to be able to shrink the size of transistors at a somewhat predictable cadence.
The benefits, however, changed. With so-called “Dennard Scaling,” chip designers could increase clock speed, reduce power—or both—with transistor shrinks. In practical terms, it meant that PC makers, phone designers and software developers could plan on a steady stream of hardware advances.
Dennard Scaling effectively stopped in 20061. New technologies for keeping the hamster wheel spinning needed to be found, and fast.
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October 29, 2024
Nine Things to Remember About the Future of Copper in Computing
By Michael Kanellos, Head of Influencer Relations, Marvell and Vienna Alexander, Marketing Content Intern, Marvell
Is copper dead?
Not by a long shot. Copper technology, however, will undergo a dramatic transformation over the next several years. Here’s a guide.
1. Copper is the Goldilocks Metal
Copper has been a staple ingredient for interconnects since the days of Colossus and ENIAC. It is a superior conductor, costs far less than gold or silver and offers relatively low resistance. Copper also replaced aluminum for connecting transistors inside of chips in the late 90s because its 40% lower resistance improved performance by 15%1.
Copper is also simple, reliable and hearty. Interconnects are essentially wires. By contrast, optical interconnects require a host of components such as optical DSPs, transimpedance amplifiers and lasers.
“The first rule in optical technology is ‘Whatever you can do in copper, do in copper,’” says Dr. Loi Nguyen, EVP of optical technology at Marvell.
2. But It’s Still a Metal
Nonetheless, electrical resistance exists. As bandwidth and network speeds increase, so do heat and power consumption. Additionally, increasing bandwidth reduces the reach, so doubling the data rate reduces distance by roughly 30–50% (see below).
As a result, optical technologies have replaced copper in interconnects five meters or longer in data centers and telecommunication networks.
Source: Marvell
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September 25, 2024
Marvell COLORZ 800 Named Most Innovative Product at ECOC 2024
By Michael Kanellos, Head of Influencer Relations, Marvell
With AI computing and cloud data centers requiring unprecedented levels of performance and power, Marvell is leading the way with transformative optical interconnect solutions for accelerated infrastructure to meet the rising demand for network bandwidth.
At the ECOC 2024 Exhibition Industry Awards event, Marvell received the Most Innovative Pluggable Transceiver/Co-Packaged Module Award for the Marvell® COLORZ® 800 family. Launched in 2020 for ECOC’s 25th anniversary, the ECOC Exhibition Industry Awards spotlight innovation in optical communications, transport, and photonic technologies. This recognition highlights the company’s innovations in ZR/ZR+ technology for accelerated infrastructure and demonstrates its critical role in driving cloud and AI workloads.
