Archive for the 'Coherent DSP' Category
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November 05, 2026
Marvell Earns LEAP Award for 1.6T Optical DSP Platform Portfolio
By Vienna Alexander, Marketing Content Professional, Marvell
Design World recently announced their 2026 LEAP (Leadership in Engineering Achievement) Awards winners. The Marvell® 1.6T optical DSP platform portfolio has been honored in the connectivity category.
Marvell has decades of expertise in optical DSPs and ushered in the 1.6T era. The portfolio being honored was announced earlier this year and spans Ara T, Ara X, Aquila M and Petra.
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September 29, 2026
Marvell Wins EDGE Award for COLORZ 1600 2nm 1.6T ZR/ZR+ Pluggable Optical Platform
By Vienna Alexander, Marketing Content Professional, Marvell
In the 2026 EDGE awards, the Marvell® COLORZ® 1600 2nm 1.6T ZR/ZR+ pluggable optical platform won the Machine Vision and Optical Components & Systems category.
Electronic Design presented this year’s winners and honorees to celebrate recent design and engineering feats that excel in the industry. These innovations are pushing the bounds and represent the leading “EDGE” of technology.
Marvell COLORZ 1600 is the industry’s first 1.6T ZR/ZR+ data center interconnect (DCI) pluggable. Powered by Marvell Electra, the industry’s first 2nm 1.6T ZR/ZR+ coherent DSP, the device delivers efficient, high-performance and secure optical transmission for hyperscale AI and cloud networks globally. The pluggable is purpose-built for long-distance links; COLORZ 1600 connects campus (20km), metro (120km) and regional (1,000km) data centers at 1.6T.
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July 08, 2026
Scaling AI Networks with Intelligent Ethernet: Validating Packet Trimming, Auto Load Balancing (ALB) and Ultra Ethernet Transport (UET) on Marvell Teralynx
By Vikram Dattatri, Senior Engineer, Cloud Platform Group, Marvell
Packet trimming doesn’t prevent traffic losses from occurring; instead, it streamlines the process for recovering them. It is also one of many technologies Marvell is developing to optimize networks for the AI era.
Artificial intelligence infrastructure is driving a fundamental shift in how data center networks are designed, validated, and deployed. As clusters scale to thousands—or even tens of thousands—of GPUs, the network is no longer just a connectivity layer. It becomes a tightly coupled component of the compute system, directly impacting job completion time, efficiency and overall cost.
To address these evolving requirements, Ethernet is undergoing a transformation. At OFC 2026, Marvell and Keysight Technologies demonstrated (see the video below) how next-generation Ethernet fabrics can meet the demands of AI workloads through a combination of advanced features and realistic validation. Leveraging Keysight’s KAI Data Center Builder and AresONE‑M 800GE platform, the collaboration showcased how the Marvell® Teralynx® switch fabric supports emerging Ultra Ethernet Consortium (UEC) capabilities, with a particular focus on packet trimming, Auto Load Balancing (ALB) and Ultra Ethernet Transport (UET).
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June 17, 2026
Plasmonics: A Path to Higher Bandwidth in Optics in the AI Era
By Claudia Hoessbacher, Senior Director, and Wolfgang Heni, Director, Optical Engineering, Marvell
Plasmons have been used to accelerate drug discovery, enhance the sensitivity of sensors and even create artistic treasures in the Roman era.
Ongoing research at Marvell seeks to harness them to improve the performance of optical networks for the AI era. Plasmonics, a technology that leverages the properties of surface plasmon polaritons (SPPs), provides a promising pathway for enhancing the roadmap of silicon photonic (SiPho) light engines, a critical component inside optical modules.
Plasmonic-based SiPho light engines could support modules operating at 3.2T and beyond while consuming a fraction of the space and power per bit of modules based on existing technologies. Manufacturers could leverage foundry process technologies for scaling production.
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May 28, 2026
Open CPX Sets the Stage for More Flexible, Scalable Connectivity
By George Hervey, Associate Vice President, Cloud Switch Marketing, Marvell
Co-packaged connectivity is coming. The Open CPX MSA (Co-packaging Multisource Agreement) is working to simplify adoption.
The consortium, which includes Marvell and other leaders in connectivity, is developing specifications and standards for solutions for integrating near-packaged optical (NPO) and/or co-packaged optical (CPO) technology into switches and servers in scalable, repeatable ways. Members are also working to support interoperability with co-packaged copper (CPC).
The idea is to give data center service providers, equipment manufacturers and others a unified framework for next-generation connectivity to accelerate innovation and meet the surging demand for these technologies. Fewer than one million near- and co-packaged ports shipped in 2025, according to LightCounting; by 2030, shipments are projected to surpass 100 million ports per year.1 Standards that can ensure predictability and flexibility will be critical in enabling this expected growth.
“The initial target of the MSA will be to develop an optimized optical engine with a defined pluggable socket and electrical connector system supporting high speed and high-density connectivity between a switch or processor and co-packaged and near-package interconnects,” the Open CPX MSA website states. “The specifications will define connector mechanicals, thermals, electrical pinout, mechanical form factors, electrical, optical, and management interface specifications to ensure interoperability between multiple vendors of Open CPX.”
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- Marvell Expands Collaboration with Aviz Networks to Shape the Future of Open Networking
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