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Archive for the 'Data Center' Category

  • December 16, 2025

    Custom Silicon: A Sea Change for Semiconductors

    By Sandeep Bharathi, president, Data Center Group, Marvell

    This blog was originally posted at Fortune.

    Semiconductors have transformed virtually every aspect of our lives. Now, the semiconductor industry is on the verge of a profound transformation itself.

    Customized silicon—chips uniquely tailored to meet the performance and power requirements of an individual customer for a particular use case—will increasingly become pervasive as data center operators and AI developers seek to harness the power of AI. Expanded educational opportunities, better decision making, ways to improve the sustainability of the planet all become possible if we get the computational infrastructure right.

    The turn to custom, in fact, is already underway. The number of GPUs—the merchant chips employed for AI training and inference—produced today is nearly double the number of custom XPUs built for the same tasks. By 2028, custom accelerators will likely pass GPUs in units shipped, with the gap expected to grow.

    Custom AI accelerators are expected to pass GPUs in unit shipments

  • December 02, 2025

    5 Times More Queries per Second: What CXL Compute Accelerators Can Do for AI

    By Khurram Malik, Senior Director of Marketing, Custom Cloud Solutions, Marvell

    Near-memory compute technologies have always been compelling. They can offload tasks from CPUs to boost utilization and revenue opportunities for cloud providers. They can reduce data movement, one of the primary contributors to power consumption,1  while also increasing memory bandwidth for better performance.  

    They have also only been deployed sporadically; thermal problems, a lack of standards, cost and other issues have prevented many of these ideas giving developers that goldilocks combination of wanted features that will jumpstart commercial adoption.2

    This picture is now changing with CXL compute accelerators, which leverage open standards, familiar technologies and a broad ecosystem. And, in a demonstration at OCP 2025, Samsung Electronics, software-defined composable solution provider Liqid, and Marvell showed how CXL accelerators can deliver outsized gains in performance.

    The Liqid EX5410C is a demonstration of a CXL memory pooling and sharing appliance capable of scaling up to 20TB of additional memory. Five of the 4RU appliances can then be integrated into a pod for a whopping 100TB of memory and 5.1Tbps of additional memory bandwidth. The CXL fabric is managed by Liqid’s Matrix software that enables real-time and precise memory deployment based on workload requirements: 

  • November 20, 2025

    Video Series: The Future of Optical Technology

    By Vienna Alexander, Marketing Content Professional, Marvell

    Optical connectivity is the backbone of AI servers and an expanding opportunity where Marvell shines, given its comprehensive optical connectivity portfolio.

    Marvell showcased its notable developments at ECOC, the European Conference on Optical Communication, alongside various companies contributing to the hardware needed for this AI era.

    Learn more about these impactful optical innovations that are enabling AI infrastructure, plus the trends and goings-on of the market.

     

     

  • November 20, 2025

    The Next Step for AI Storage: GPU-initiated and CPU-initiated Storage

    By Chander Chadha, Director of Marketing, Flash Storage Products, Marvell

    AI is all about dichotomies. Distinct computing architectures and processors have been developed for training and inference workloads. In the past two years, scale-up and scale-out networks have emerged.

    Soon, the same will happen in storage.

    The AI infrastructure need is prompting storage companies to develop SSDs, controllers, NAND and other technologies fine-tuned to support GPUs—with an emphasis on higher IOPS (input/output operations per second) for AI inference—that will be fundamentally different from those for CPU-connected drives where latency and capacity are the bigger focus points. This drive bifurcation also likely won’t be the last; expect to also see drives optimized for training or inference.

    As in other technology markets, the changes are being driven by the rapid growth of AI and the equally rapidly growing need to boost the performance, efficiency and TCO of AI infrastructure. The total amount of SSD capacity inside data centers is expected to double to approximately 2 zettabytes by 2028 with the growth primary fueled by AI.1 By that year, SSDs will account for 41% of the installed base of data center drives, up from 25% in 2023.1

    Greater storage capacity, however, also potentially means more storage network complexity, latency, and storage management overhead. It also means potentially more power. In 2023, SSDs accounted for 4 terawatt hours of data center power, or around 25% of the 16 TWh consumed by storage. By 2028, SSDs are slated to account for 11TWh, or 50%, of storage’s expected total for the year.1 While storage represents less than five percent of total data power consumption, the total remains large and provides incentives for saving. Reducing storage power by even 1 TWh, or less than 10%, would save enough electricity to power 90,000 US homes for a year.2 Finding the precise balance between capacity, speed, power and cost will be critical for both AI data center operators and customers. Creating different categories of technologies becomes the first step toward optimizing products in a way that will be scalable.

  • November 06, 2025

    Marvell Wins LEAP Award for 1.6T LPO Optical Chipset

    By Vienna Alexander, Marketing Content Professional, Marvell

    Marvell Wins LEAP Award for 1.6T LPO Optical Chipset

    Marvell was announced as the top Connectivity winner in the 2025 LEAP Awards for its 1.6 Tbps LPO Optical Chipset. The judges' remarks noted that “the value case writes itself—less power, reduced complexity but substantial bandwidth increase.” Marvell earned the gold spot, reaffirming the industry-leading connectivity portfolio it is continually building.

    The LEAP (Leadership in Engineering Achievement Program) Awards recognize best-in-class product and component designs across 11 categories with the feedback of an independent judging panel of experts. These awards are published by Design World, the trade magazine that covers design engineering topics in detail.

    This chipset, combining a 200G/lane TIA (transimpedance amplifier) and laser drivers, enables 800G and 1.6T linear-drive pluggable optics (LPO) modules. LPO modules offer longer reach than passive copper, at low power and low latency, and are designed for scale-up compute-fabric applications.

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