By Wolfgang Sauter, Customer Solutions Architect - Packaging, Marvel
The continued evolution of 5G wireless infrastructure and high-performance networking is driving the semiconductor industry to unprecedented technological innovations, signaling the end of traditional scaling on Single-Chip Module (SCM) packaging. With the move to 5nm process technology and beyond, 50T Switches, 112G SerDes and other silicon design thresholds, it seems that we may have finally met the end of the road for Moore’s Law.1 The remarkable and stringent requirements coming down the pipe for next-generation wireless, compute and networking products have all created the need for more innovative approaches. So what comes next to keep up with these challenges? Novel partitioning concepts and integration at the package level are becoming game-changing strategies to address the many challenges facing these application spaces.
During the past two years, leaders in the industry have started to embrace these new approaches to modular design, partitioning and package integration. In this paper, we will look at what is driving the main application spaces and how packaging plays into next-generation system architectures, especially as it relates to networking and cloud data center chip design.
By Lindsey Moore, Marketing Coordinator, Marvell
Flash Memory Summit, the industry's largest trade show dedicated to flash memory and solid-state storage technology, presented its 2020 Best of Show Awards yesterday in a virtual ceremony. Marvell, alongside Hewlett Packard Enterprise (HPE), was named a winner for "Most Innovative Flash Memory Technology" in the controller/system category for the Marvell NVMe RAID accelerator in the HPE OS Boot Device.
Last month, Marvell introduced the industry’s first native NVMe RAID 1 accelerator, a state-of-the-art technology for virtualized, multi-tenant cloud and enterprise data center environments which demand optimized reliability, efficiency, and performance. HPE is the first of Marvell's partners to support the new accelerator in the HPE NS204i-p NVMe OS Boot Device offered on select HPE ProLiant servers and HPE Apollo systems. The solution lowers data center total cost of ownership (TCO) by offloading RAID 1 processing from costly and precious server CPU resources, maximizing application processing performance.